Meeting the horizontal electroless copper plating challenge. A new bath formulation was developed, which allowed deposition of copperrich cunip alloys in electroless acidic solutions in the absence of formaldehyde. To effectively work out a complex surface area, as shown left. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed. A high reliability, stressfree copper deposit for fpc. The deposition rate and deposit properties of electroless copper plating depend on the copper complexing agent, reducing agent, bath temperature and ph. A wide variety of electroless copper plating options are available to you, there are 437 suppliers who sells electroless copper plating on, mainly located in asia. Electroless copper can provide a seed layer on a dielectric material for subsequent acid copper electroplating.
Ella last name deleted for privacy by editor student boulder, colorado, usa. Feb 16, 2017 in this study, graded nip coatings were deposited on copper substrates by electroless plating method. Electroless copper solutions containing additives from electroless a in figure 4 were evaluated further to determine the. The first step in the plating process is the chemical deposition of a very thin layer of copper on the hole walls. A new electroless plating process for cu and cup alloys. Electroless plating of copper on surfacemodified glass. Randomly distributed pd particles with a typical separation of 100 nm are just resolved in the micrograph. Traditional electroless copper plating solutions often use formaldehyde as the reducing agent because of its low cost and the high quality of the deposit 38.
Some information on electroless gold plating products finishing. A decorative copper plating process was developed by yuan 10 and his team members. Electroless nickel plating can be a simple and effective way of applying a nickel plate over steel, iron, copper, brass, zincated aluminum and copper alloys. A new basic formulation of electroless cup plating using sodium. Electroless plating, however, uses a chemical deposition process instead of an external electrical current to achieve the desired result. Fundamental aspects of electroless copper plating composition of electroless copper plating solutions the mixed potential theory application of the mixed potential theory partial reactions kinetics of electroless copper deposition catalysts for electroless copper plating properties of electroless copper deposits. A high reliability, stressfree copper deposit for fpc, polyimide and rigidflex.
The results are then analyzed in terms of equivalent electrical circuit using zview program. I need electroless copper coating on surface of aluminaal2o3 substrate. Tongcheng guo, yu wang, and jintian huang copper coating was deposited on poplar veneer using different relative concentrations of plating solution. Its a common sense that all pcb thickness must be electroplated. Preparation and characterization of electroless cup deposition. Tetrakis 2hydroxypropylethylenediamine or a salt thereof, and ii n2hydroxyethylethylenediaminen,n,ntriacetic acid or a salt thereof, as complexing agents, as well as to a. Impurities of any kind can cause either too much plating, eventually decomposing the bath, or poisoning of the catalytic reaction so that no plating will occur.
Electroless copper deposition on pet sheets scientific. Pretreatment for copper electroless plating on tantalum substrate seung hwan cha, chang hwa lee and jae jeong kim research center for energy conversion and storage school of chemical engineering, seoul national university shillimdong, kwanakgu, seoul 151 742, korea with decreasing feature size in integrated circuit. Koc adepartment of chemical and environmental engineering, national university of singapore. The gold can also be deposited from a borohydride system on the active metals copper, nickel, cobalt and iron.
The line is fully computer controlled and the panels are carried through a series of chemical and rinsing baths by the overhead crane. Ella last name deleted for privacy by editor student. Electroless, or autocatalytic, metal plating is a non electrolytic method of deposition from solution. I am a researcher at the south bank university chemical engineering research center, and i would like to know how i can coat alumina, aluminium oxide, particles with copper via an electroless. Finally, a copper film is formed on the palladiumactivated glass substrate through copper electroless plating and the surfacecoppered glass material is therefore acquired. Expired lifetime application number inventor hyogo hirohata masahiro oita katsuhiko honjo. Formulas for electroless copper plating baths finishing.
A discussion started in 2001 but continuing through 2017. Read the paper titled circuposit 6530 catalyst process for electroless copper metallization, which details the reliability performance and horizontal electroless cu plating processes using this formulation, and has been presented on oct. The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a reducing agent or a source of a reducing agent, and a combination comprising i. Jan 21, 2016 each laminate was then immersed in an aqueous electroless copper plating composition of formulation 1. Electroless plating provides a more even plate layer than electroplating, even on complex geometries. Electroless copper plating is widely used for the fabrication of printed circuit boards and other electronic devices. The utilization of electroless nickelphosphorus en coatings has witnessed a staggering increase during the last two decades. The operator clamps the production panels into the jigs. The minimum necessary components of an electroless plating. Electroless copper plating solutions comprised of 0. Electroless copper deposition process of rigid pcb. T t e r w r t h e i n e m a n n introduction ar communication. In this study, graded nip coatings were deposited on copper substrates by electroless plating method. Pdf modelling of surfactants and chemistry for electroless.
Theoretical conditions for the electroless plating of a metal may be determined from the pourbaix 1 diagrams for the metal and the principal element in the reducing agent. Properties of electroless cu films optimized for horizontal. Electroless copperzinc plating is an electroless alkaline copper process engineered for plating corrosionresistant cuzn alloys on varieties of substrates including semiconductors, glass, polymers et al. Meeting the horizontal electroless copper plating challenge with an ionic palladium catalyst process november 02,2015 electronic devices have become an indispensable part of peoples daily life in every corner of the globe. Electroless plating of silver plating process and the reaction mechanism plated film practice of electroless silver plating. Electroless nickel plating formulation for automotive and mechanical parts electro less plating processes are considered to be much convenient, cheaper and best for deposition on parts with lot of holes, cleavages, bents, curves, abnormal shapes, threading etc. Meeting the horizontal electroless copper plating challenge dupont. Electroless plating, also known as autocatalytic plating, or conversion coating, is a way of plating your part without using an external power source. Nickel is the most common plating material deposited in electroless plating processes.
At the initial stage the electroless plating of copper and nickel lea. The frequency and amount of replenishment required will depend upon the baths deposition rate, as well as the workload ftgal being processed. A study on the interfacial composition of the electroless. Chapter 12 fundamental aspects of electroless copper plating. Copper metal from sulfate, nitrate or chloride salts. Tongcheng guo, yu wang, and jintian huang copper coating was deposited on poplar. This paper describes metallization of pet surface by snfree electroless deposition eld of thin copper layer. Electroless plating, as a surface finishing technique, has been known for more than a century, but only in the last 20 to 30 years have practical commercial processes been developed for plating on a large scale. Pdf electroless copper deposition into anodic aluminium oxide.
Improved abs plastic activating treatment for electroless copper plating peichi yen department of chemical engineering, yung ta junior college of technology and commerce, 316 chunshan road, linlo, pingtung, taiwan received 14 april 1994 revised march 1995 polymer vol. This paper discusses the performance of an electroless copper plating. Laserinduced silver seeding on filter paper for selective. Electroless gold can be deposited from a borohydride system on palladium, rhodium, silver and gold as well as copper, nickel, cobalt and iron.
The effect of some additives on electroless copper deposition. Prior art keywords bath copper formaldehyde ph concentration prior art date 19671128 legal status the legal status is an assumption and is not a legal conclusion. Developments in electroless copper processes to improve. Electroless copper plating from the technology data exchange linked to trusted tde listed vendors. A study on the interfacial composition of the electroless copper plated bpdapda polyimide sheet w. Electroless copper plating on aluminaaluminum thin films. A study on the interfacial composition of the electrolesscopperplated bpdapda polyimide sheet w. Conventional electroless copper systems often required pre. Corrosion resistance of electroless cup and cupsic. Vertical electroless copper metallization macdermid. The top countries of suppliers are philippines, china, and taiwan, china, from which the percentage of electroless copper plating supply is 1%, 98%, and 1% respectively. It is operated at ph values above 11 and this bath may release poisonous gases during operation. Copper is consumed as the work being processed is plated, and requires frequent replenishment to keep the bath in chemical balance. A description similar to the one provided for electroplating will be great.
Many outstanding characteristics of the en coating method have generated a lot of interest in various industries including oil and. Chemical deposition of metallic films from aqueous solutions autocatalytic. Electroless plating processes cost less, but only in terms of time and. Not all kinds of pcb board need through the electroless copper deposition process.
Conventional electroless copper plat ing baths usually contain the following ingredients. Vertical electroless copper metallization macdermid enthone. Copper, cobalt, nickel, tin, and cadmium are also examples of electrolytic plating. Electroless copper in printed wiring board fabrication 335 fig. Cyclic voltammetry of copper metal in lithium hydroxide solution at elevated temperatures. The new bath was found stable and operated upto 2 hours. Could you provide me the best way to activate the surface of alumina, that does not involve pdcl palladium chloride. Each laminate was then immersed in an aqueous electroless copper plating composition of formulation 1. Msystem integrated desmear electroless copper combines a statistically developed and proven primary metallization system to fit the needs of the printed circuit board industry. A composition comprising one or more sources of copper ions, one or. Wo2014154702a1 electroless copper plating solution. Evaluation of electroless nickelphosphorus en coatings. Because the electrolytic plating process requires that a conforming anode be constructed, more time and skilled craftsmanship are involved, and that results in a sizable vendor invoice.
Can anybody tell me the formula for electroless copper. Improved abs plastic activating treatment for electroless. After 1 s of electroless cu plating many more particles are visible on the surface, whichshows that only thelargestpd nuclei were visible before plating. Studies of electroless copper plating on poplar veneer. Electroless copper plating baths include alternative reducing agents to. Conventional ec plating baths usually use formaldehyde hcho as the reducing agent vaskelis et al. Electroless deposition of copper in acidic solutions using. For the past 20 years, this process has become the industry standard for void free coverage. Contact angle measurement and xps analysis were carried out at each stage in. The specimens were prepared by dropping the thfsolution of the mixture onto a. The invention relates to an electroless aqueous copper plating solution. A discussion started in 1996 but continuing through 2017. It was found that the incorporation of phosphorus in copper matrix increased the corrosion resistance of.
Here, we discuss a successful formulation of enig that has been in continuous use in largescale pcb production for more than two years. Electroless copper plating on alumina aluminum thin films. Electroless copper deposition process of rigid pcb 4mcpcb. The process can be tailored to run in vertical or horizontal equipment for everything from high. Though cupric ions do not catalyse the oxidation of hypophosphite, we show that, in the presence of a low concentration of niii species, it is possible, even at low phs, to induce the. Koc adepartment of chemical and environmental engineering, national university of singapore, 10 kent ridge crescent, singapore 119260. Transmission electron microscopy tem images were obtained using a jeol model jem2100 microscope at an acceleration voltage of 100 kv. The surface morphology and crosssection observations were made using scanning electron. I would like to understand the theory of electroless nickel plating. Many outstanding characteristics of the en coating method have generated a lot of interest in various industries including oil and gas, electronic, chemical, automotive, aerospace, and mining. Alternate means of chemicals which can activate the surface. Several formulations of enig plating have been tried.
The extensive demand for these applications promotes the development of copper formulation and plating techniques. Simply place an imaginary grid of 1 squares over the part, and count the whole squares. Formulation of novel electroless plating process for cu. The formulation of nano3ds electroless copperzinc plating solution provides excellent throwing power. The introduced amino groups can effectively adsorb the palladium, the catalysts which could initiate the subsequent cu electroless plating, onto the glass substrate surface. Selling chrome nickel cadmium brass gold silver and metal polishing supplies. The sheet resistance of the electroless copper deposits from different plating solutions against plating time. Electroless plating, also known as chemical or autocatalytic plating, is a nongalvanic plating method that involves several simultaneous reactions in an aqueous solution, which occur without the use of external electrical power. Chapter electroless copper in printed wiring board fabrication. Some information on electroless gold plating products. Tinpalladium catalysts for electroless plating johnson. Electroless plating method electroless plating techniques spc.
It is mainly different from electroplating by not using external electrical power. Electroless nickel, nickelcobalt alloys, nickelptfe, nickelboron, and other nickelbased composites are examples of electroless plating materials. Electroless plating of copper on surfacemodified glass substrate. The process involves placing the part in an aqueous solution and depositing nickel, creating a catalytic reduction of nickel ions to plate the part without any electrical energy dispersal. When formaldehyde is used as the reducing agent in the plating bath, the electroless copper deposition can be considered to consist of the following reaction. It is a distinct metal finishing process which has some of the features of both electroplating and immersion plating. Why should we chemical deposit copper on hole wall. Electroless nickel plating formulation for automotive and. Images of samples plated for 1, 5 and 10 s exhibit isolated particles.
Sinotech is dedicated to managing your project onsite and delivering parts to you at lower prices but the same quality, service and terms as a domestic supplier. Electroless copper plating process download pdf info. The following bath i showed good results for electroless nickel plating on copper pads and pth holes. Eld is a multistep process involving silanization with tms, activation with pdcl2 and copper deposition. Early innovations led to the development of the msystemsm85, our highly successful heavy deposition electroless copper process. Autocatalytic electroless plating, also known as electroless plating, is a plating process which involves deposition without any current applied. Prior to introduction to eld process, the pet surface was plasmapretreated in argon atmosphere.
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